Thermal Analysis Testing System-Product Center-Congtical Technology

Temperature-Dependent Resistivity Measurement System

The variable-temperature resistivity measurement system (RMS) employs the four-probe method and is capable of determining the electrical resistivity of materials. It can measure the resistivity of bulk semiconductor samples, semimetallic materials (such as constantan, nickel, bismuth, etc.), and certain nonmetallic materials (including graphite and carbon-based materials). This system finds extensive application in temperature control, thermoelectric power generation, cooling of electronic devices (e.g., infrared and far-infrared detectors, high-speed chips), medical equipment, high‑temperature superconductivity, as well as air-conditioning systems for spacecraft and submarines, among many other critical fields.

Dielectric Temperature Spectrum Measurement System

The variable-temperature dielectric testing system is a measurement platform designed to investigate the dielectric properties of materials. Dielectrics are insulating materials that can be polarized under an electric field, and their dielectric performance is typically characterized by the relative permittivity and dielectric loss. To assess the thermal stability of dielectric properties, it is often necessary to measure how dielectric parameters—such as relative permittivity and dielectric loss—vary with temperature over a specified range. This is particularly important for piezoelectric and ferroelectric materials, where temperature‑dependent dielectric behavior plays a crucial role in both theoretical research and practical applications.

High-Low Temperature In-Situ Mechanical Testing System

The FMS is used to perform high- and low-temperature microstructural observations of materials under tensile or compressive loading; it is primarily employed in research areas such as organic polymers, nanomaterials, metallic materials, and composite materials. This instrument serves as an essential tool for investigating the mechanical properties of new materials.

Hall Effect Measurement Instrument

It can be used for room-temperature measurements of the Hall coefficient, resistivity, electron mobility, and carrier concentration in common semiconductor materials, making it an essential tool for studying the electronic properties of semiconductors and electronic materials.

High-Low Temperature Hall Effect Measurement System

Semiconductor Materials Research: By investigating electron mobility and carrier concentration, this research elucidates the temperature-dependent behavior of semiconductor materials and the mechanisms underlying scattering. The focus is primarily on semiconductor wafer fabrication processes and applications such as solar cells. Magnetic Materials Research: Studies of the Hall effect and magnetoresistance provide critical support for advancements in magnetic storage, magnetic sensors, and related fields. Furthermore, for certain spintronic materials, variable-temperature Hall-effect measurements help explore the potential applications of novel spintronic devices.

High-Low Temperature Thermoelectric Parameter Measurement System

It is widely used to measure the Seebeck coefficient and resistivity of bulk metal and semiconductor samples, as well as nano‑thin film samples. Thermoelectric materials are functional materials that directly convert thermal energy into electrical energy and vice versa. The Seebeck coefficient, resistivity, and thermal conductivity are the three primary parameters in thermoelectric material research. The TMS‑2 is extensively employed to determine the Seebeck coefficient and resistivity of metallic and semiconductor materials under both high‑ and low‑temperature conditions; test specimens may include bulk samples, wire‑shaped samples, and thermoelectric thin films with thicknesses ≥ 50 nm.

Thermoelectric Performance Analyzer

It can be used for room-temperature measurements of the Seebeck coefficient in conventional thermoelectric materials, as well as for determining the ZT value and electrical resistance of semiconductor cooling modules, making it an essential tool in the research and production of thermoelectric materials and devices.

Device Quality Inspection Instrument

The Thermoelectric Device Tester (TEAM) employs the Harman method to perform rapid measurements on thermoelectric devices, assess their performance, and identify potential quality issues that may arise during manufacturing—such as poor thermal and electrical contact caused by defects like solder leakage or cold solder joints, reversed polarity of small thermoelectric pellets, or degradation of thermoelectric material properties.

Radiative Cooling Test System

The PDRC can be used to measure the radiative cooling power of materials and to compare their radiative cooling performance under adiabatic conditions. Its temperature-control capability allows the target temperature to track the ambient temperature, while simultaneously recording the heating power and the solar irradiance. Radiative cooling finds widespread applications in building materials and in space.

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