High-Low Temperature Thermoelectric Parameter Measurement System

It is widely used to measure the Seebeck coefficient and resistivity of bulk metal and semiconductor samples, as well as nano‑thin film samples. Thermoelectric materials are functional materials that directly convert thermal energy into electrical energy and vice versa. The Seebeck coefficient, resistivity, and thermal conductivity are the three primary parameters in thermoelectric material research. The TMS‑2 is extensively employed to determine the Seebeck coefficient and resistivity of metallic and semiconductor materials under both high‑ and low‑temperature conditions; test specimens may include bulk samples, wire‑shaped samples, and thermoelectric thin films with thicknesses ≥ 50 nm.

Technical Specifications Product Features Download Materials

Parameter type	Project	Technical Specifications
Capability Parameters	Programmed temperature repeatability	≤1%
	Temperature-programming rate deviation	≤10%
	Seebeck coefficient resolution	0.05 μV/K
	Resistivity resolution	0.05μΩ2m
	Relative error of the Seebeck coefficient	≤5%
	Relative error of resistivity	≤7%
Test parameters	Sample size	Length (10–180) mm; width (3–5) mm; thickness ≥ (50) nm
	Seebeck test range	8-5000uV/K
	Resistivity test range	0.1–10^6 μΩ·m
Temperature parameter	Temperature range	-190℃~300℃	RT~300℃
	Cooling method	Liquid nitrogen cooling	-
	Heating method	Heating plate heating	Heating plate heating
	Maximum cooling rate	-20K/min	Natural cooling
	Maximum heating rate	15K/min
Other parameters	Environmental temperature uniformity	3K
	Temperature control accuracy	±0.2K
	Vacuum level requirement	≤1Pa
	Vacuum volume	2L
	Vacuum interface	KF25/KF16