Thermoelectric Performance Testing (ZTmatrix)-Product Center-Congtical Technology

High-Low Temperature Thermoelectric Parameter Measurement System

It is widely used to measure the Seebeck coefficient and resistivity of bulk metal and semiconductor samples, as well as nano‑thin film samples. Thermoelectric materials are functional materials that directly convert thermal energy into electrical energy and vice versa. The Seebeck coefficient, resistivity, and thermal conductivity are the three primary parameters in thermoelectric material research. The TMS‑2 is extensively employed to determine the Seebeck coefficient and resistivity of metallic and semiconductor materials under both high‑ and low‑temperature conditions; test specimens may include bulk samples, wire‑shaped samples, and thermoelectric thin films with thicknesses ≥ 50 nm.

Thermoelectric Performance Analyzer

It can be used for room-temperature measurements of the Seebeck coefficient in conventional thermoelectric materials, as well as for determining the ZT value and electrical resistance of semiconductor cooling modules, making it an essential tool in the research and production of thermoelectric materials and devices.

Device Quality Inspection Instrument

The Thermoelectric Device Tester (TEAM) employs the Harman method to perform rapid measurements on thermoelectric devices, assess their performance, and identify potential quality issues that may arise during manufacturing—such as poor thermal and electrical contact caused by defects like solder leakage or cold solder joints, reversed polarity of small thermoelectric pellets, or degradation of thermoelectric material properties.

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