Nanoindenter Heating and Cooling Stage
The nanoindentation system’s temperature‑controlled stage is suitable for applications involving semiconductor and aerospace materials that require mechanical and thermal testing. It is primarily used to investigate how a material’s hardness, elastic modulus, and other mechanical properties vary with temperature. The system enables vacuum‑environment testing over a range from −190°C to 400°C, without causing oxidation or frost formation on the sample.
Technical Specifications
Product Features
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Product model | TS400E-NANO |
Cooling method | TN |
Temperature range | -160℃~400℃ |
Temperature resolution | 0.1℃ |
Temperature control accuracy | ±0.01℃ |
Maximum heating rate | 50℃/min |
Maximum cooling rate | -30℃/min |
Sample stage dimensions | 25mm*25mm |
Vacuum level | Gas purge |
Size | 90mm*90mm*50mm |
Net weight | 1kg |
It provides vacuum‑environment testing from −190°C to 400°C without causing oxidation or frost formation on the sample.
Different structural configurations can be customized according to the indenter’s design.














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